About 3D GLASS SOLUTIONS, INC.
3DGS is a U.S.-based glass packaging foundry that provides advanced glass substrates for semiconductor packaging, supporting next-generation RF, HPC, photonics, and defense applications. Their solutions address thermal, electrical, and dimensional challenges in high-frequency and high-performance systems.
Manufacturing of glass substrates for advanced packaging3D heterogeneous integration (3DHI) foundry servicesHigh-performance fused silica (HPFS) glass solutionsRF subsystem implementation with SWaP-C benefitsSecure onshore foundry with high-temperature and RAD HARD qualificationPhotonics platforms for LiDAR, optical communications, and quantum photonic subsystemsHPC/AI glass interposer support for chiplet integrationSensor substrates with biocompatibility, optical transparency, and chemical inertness
Recent Federal Awards
| Award | Agency | Amount | Date |
|---|---|---|---|
| GLASS 3D HETEROGENEOUS INTEGRATION (3DHI) FOR MILLIMETER WAVE EW | Department of Defense | $1.8M |
Teaming History
Prime contractors 3D GLASS SOLUTIONS, INC. has worked under:
- Lockheed Martin Corporation — 110 subcontract(s)
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Claim this profile See matched opportunitiesData compiled from public government sources including SAM.gov, USAspending.gov, and state procurement records. Last verified against federal award records. Inaccurate? Let us know.