About MPE, INC
MPE, Inc. (Micro Precision Engineering) is an ITAR-registered company that provides custom wafer dicing and resizing services for silicon and silicon on insulator (SOI) wafers, serving industries such as medical, military, academia, and semiconductor manufacturing.
Custom wafer dicing and resizing servicesProcessing wafers up to 300mm/12" in diameter and 10mm thickUtilizing innovative wafer coring and edge grinding techniquesLow-stress wafer resizing with beveled and rounded edgesHandling a wide variety of materials including alumina, AlN, GaN, fused silica, glass, quartz, germanium, SiC, Lexan, LiNbO3, SOI, SiGe, and silicon wafersMulti-pass cuts, ramp up table/feed rates, and plunge cuts using Loadpoint dicing sawsHigh pressure wash stations for post-dicing cleaningUV exposure capability for tape curing
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