About HEISLER SEMICONDUCTOR LLC
Heisler Semiconductor provides advanced semiconductor packaging services on US soil, offering end-to-end solutions from design to volume production, supported by AI-assisted process control and data-driven engineering.
Advanced Packaging (Die attach, Wire bond, Flip chip, Hermetic seal, 3D integration)Wafer-Level Processing (Lithography, TSV, Deposition, Etch, CMP, RDL)Laser Micromachining (Micro-vias, Dicing, Singulation, Marking)Inspection & Metrology (X-ray, 3D AOI, SEM, Sub-micron metrology)Engineering & AI (DOE, SPC & data control, AI-assisted development, Inspection software)Design & Firmware (Circuit, Device, Hardware, Firmware, RF eval boards)Materials (Silicon, Sapphire, AlN, Polyimide, Underfills, Thin-film)Reliability & Test (Thermal cycling, Screening, Hermetic test, Cross-section FA)
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