About FIRST LEVEL INC.
First Level Inc. is a technology-based contract assembly facility specializing in first-level microelectronics packaging, offering services such as die attach, wire bonding, and component assembly in Class 10,000 ESD protected cleanrooms.
Prototype to Production ServicesPackaging AssemblyWire BondingPrecision Die & Component AttachFlip Chip Hermetic Lid SealingBGA DicingTestingFailure Analysis & Design Validation
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