About MOSAIC MICROSYSTEMS LLC
Mosaic Microsystems is a microelectronics and photonics packaging company specializing in thin glass substrates and proprietary VIAFFIRM® bonding technology. The company provides advanced packaging solutions for next-generation applications in RF, MEMS, sensing, and photonics.
Thin glass handling and processing up to 200um thicknessCustom through-glass vias (TGV) with diameters ≤ 35umCustom filled/planar vias with Cu fillingMetallized thin glass wafer fabricationSupport for RF, MEMS, sensing, and photonic applications
Recent Federal Awards
| Award | Agency | Amount | Date |
|---|---|---|---|
| ALL-GLASS MICROWAVE MICROFLUIDIC WAFERS | Department of Commerce | $66K | |
| MICROELECTRONIC MM WAVE WIRELESS CALIBRATION ARTIFACT | Department of Commerce | $32K | |
| CHIPS COUPONS & WAFERS | Department of Commerce | $239K | |
| RESEARCH AND DEVELOPMENT | Department of Defense | $1.5M | |
| Federal contract award | Department of Commerce | $68K |
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Claim this profile See matched opportunitiesData compiled from public government sources including SAM.gov, USAspending.gov, and state procurement records. Last verified against federal award records. Inaccurate? Let us know.