About LUX SEMICONDUCTORS, INC
Lux Semiconductors provides advanced metal substrates and interposers that improve thermal dissipation and reduce warpage for system-in-package (SiP) designs. Their patented coaxial through metal vias enable high-speed signal routing and low-loss power delivery.
Metal substrates and interposers for advanced packagingPatented coaxial through metal vias for signal routing and power deliveryThermal dissipation improvement (100x higher than glass)Warpage reduction (13x more resistant than organics)Design rules for organic to metal substrate conversionSupport for 3D SiP and high-performance computing applications
Recent Federal Awards
| Award | Agency | Amount | Date |
|---|---|---|---|
| LUX SEMICONDUCTORS INC - SPACE PITCH DAY 2021 | Department of Defense | $1.7M | |
| ADVANCING THE MANUFACTURING READINESS OF SMART SUBSTRATES FOR SYSTEM-ON-FOIL ADVANCED PACKAGING | Department of Defense | $1.2M | |
| MODULAR AND CONFORMAL SYSTEM-ON-FOIL PACKAGING PLATFORM FOR HETEROGENOUS INTEGRATION | Department of Defense | $875K | |
| Federal contract award | Department of Defense | $750K |
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Data compiled from public government sources including SAM.gov, USAspending.gov, and state procurement records. Last verified against federal award records. Inaccurate, or want this page removed? Request a correction or removal.