About POLYMER ASSEMBLY TECHNOLOGY, INC
PAT (Polymer Assembly Technology) is a small business specializing in low-temperature flip chip assembly and prototyping for fine-pitch and temperature-sensitive devices, including optical, radiation, and biomedical sensors. The company was founded in 2003 and works with government and university research labs.
Low-temperature flip chip assemblyPrecision prototype and low-volume flip chip assemblyFine-pitch (100µm) pixel imaging devices assemblyAssembly of temperature-sensitive II-VI and III-V devicesHigh-density flip chip interconnections exceeding 16,000 I/OUse of silver-filled conductive epoxies with proprietary stencil printing techniqueConductive and non-conductive polymer adhesives for assemblyJoining of CdZnTe pixel-array detectors with custom VLSI chips
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