About CENTERLINE TECHNOLOGIES, LLC
Centerline Technologies provides ultra-precision services for grinding, lapping, polishing, diamond sawing, and laser machining of metals, ceramics, sapphire, and other materials for industries including telecommunications, semiconductors, defense, and security. The company was founded in 2005 and has 14,250 sq ft of manufacturing and lab space.
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Data compiled from public government sources including SAM.gov, USAspending.gov, and state procurement records. Last verified against federal award records. Inaccurate, or want this page removed? Request a correction or removal.