About AMERICAN SEMICONDUCTOR, INC
American Semiconductor (ASI) specializes in advanced packaging technology, including Semiconductor-on-Polymer™ chip scale packaging and chip-on-flex assembly, with offerings in advanced substrates, FPCBs, and engineering services.
Advanced substrates and FPCBs with features at 1umSemiconductor-on-Polymer™ chip scale packagingChip-on-flex assemblyEngineering and design servicesAdvanced packaging, assembly, and test servicesDesign and prototyping services
Recent Federal Awards
| Award | Agency | Amount | Date |
|---|---|---|---|
| D2S-0097 ULTRA-THIN CONFORMAL ELECTRONIC SYSTEM DEVELOPMENT AND CHARACTERIZATION | Department of the Interior | $1.7M | |
| MEDICAL RESEARCH AND DEVELOPMENT CONTRACT ARMY SBIR PHASE II PROPOSAL NO. A2-8272 TITLED FOREWARM: FHE MICROCL | Department of Defense | $1.1M |
Is this your company?
Claim this profile to keep it accurate — and see the federal & state opportunities GovIntel's AI has matched to AMERICAN SEMICONDUCTOR, INC right now.
Claim this profile See matched opportunitiesData compiled from public government sources including SAM.gov, USAspending.gov, and state procurement records. Last verified against federal award records. Inaccurate? Let us know.