PROMEX INDUSTRIES INC — Federal Contracts, Awards & Government Contractor Profile

About PROMEX INDUSTRIES INC

QP Technologies provides prototype and small-volume IC packaging and assembly services, helping bring designs to market faster with high-quality solutions. The company is a division of Promex Industries and specializes in microelectronic packaging, wafer preparation, and substrate development.

Wafer preparation (backgrinding and dicing)Printed Circuit Board Assembly (PCBA)Solder Mount Technology (SMT)Chip on board (COB)/Chip on flex (COF)Chiplets inventory managementMulti Chip Module (MCM) and System In Packaging (SIP)IC assembly (stacked die, flip chip bonding, air cavity QFN, open molded plastic package, BGA substrates)Custom configurations, die attach, encapsulation options, IC marking/branding

Recent Federal Awards

Award	Agency	Amount	Date
Federal contract award	Department of Defense	$17K
PCBA, UP TO 10 BOARDS, ATTACH PCB1 TO PC	Department of Defense	$9K

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Data compiled from public government sources including SAM.gov, USAspending.gov, and state procurement records. Last verified against federal award records. Inaccurate, or want this page removed? Request a correction or removal.