About PARTOW TECHNOLOGIES LLC
Partow Technologies specializes in advanced room-temperature Surface Activated Bonding (SAB) and thin-film transfer technologies for next-generation photonic, RF, quantum, and semiconductor applications. The company enables the integration of advanced materials like lithium niobate, GaN, SiC, and diamond.
Surface Activated Wafer BondingIon-Sliced Thin-Film TransferThin-Film Lithium Niobate (TFLN)Heterogeneous Photonic IntegrationAdvanced Wafer EngineeringElectro-Optic Devices and SensorsWafer-scale bondingPhotonic device fabrication
Recent Federal Awards
| Award | Agency | Amount | Date |
|---|---|---|---|
| Federal contract award | Department of Defense | $249K | |
| ATOMIC FUSION WAFER BONDING TOOL FOR ULTRA-HIGH-POWER SWITCHES | Department of Defense | $1.7M |
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Claim this profile See matched opportunitiesData compiled from public government sources including SAM.gov, USAspending.gov, and state procurement records. Last verified against federal award records. Inaccurate? Let us know.