About PAC TECH USA PACKAGING TECHNOLOGIES, INC
PacTech is a global leader in advanced packaging equipment and wafer-level packaging services, trusted by semiconductor manufacturers worldwide. Headquartered in Germany and backed by the NAGASE Group, the company brings over 30 years of precision engineering and innovation to its solutions.
Advanced Packaging EquipmentWafer Level Packaging ServicesLaser SolderingLaser Assisted BondingElectroless PlatingSolder Ball MountingWire Soldering3D and 3.5D® Packaging
Recent Federal Awards
| Award | Agency | Amount | Date |
|---|---|---|---|
| DISCS, SPACER RINGS, AND BH6 CAPILLARIES | Department of Justice | $14K | |
| Federal contract award | Department of Justice | $8K |
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Claim this profile See matched opportunitiesData compiled from public government sources including SAM.gov, USAspending.gov, and state procurement records. Last verified against federal award records. Inaccurate? Let us know.